Tony Nygard, manager enabling technologies at cochlear The flexible attitude of the ICsense design team combined with their advanced analog IC design expertise, specifically for high voltages, significantly impacted the feasibility and the successful integration of our Cochlear implant IC. They not only designed state-of-the-art circuits, but pro-actively sought ways to achieve an optimal system solution. Our cooperation has led to a highly-advanced, innovative IC implementation from which hearing impaired people all over the world will benefit.

Shannon Morton, Senior manager at Nvidia We partnered with ICsense on our integrated I/O solution to enable a fully protected 3.3V I/O with 1.8V transistors in TSMC 40 and 28nm – the first time this has been achieved – and the technology is already in production in our baseband processor for smartphones, tablets and mobile broadband devices.  ICsense’s expertise in making high-voltage circuits with low-voltage transistors led to first silicon success for this complex and innovative design.  We particularly appreciate our close cooperation with ICsense’s engineers and their proactive and flexible attitude.

Niels Trapp, Senior Manager at Renesas ICsense developed the analog front-end for our new industrial transceiver in TSMC 40nm. ICsense is a valuable partner for Renesas and we highly appreciated the flexibility, expertise and innovativeness of ICsense.

Bob Hamlin, VP of Engineering at Tego INC. As a fabless designer and producer of high memory passive RFID tags, Tego partners with skilled, innovative IC design firms that achieve excellence in their ASIC designs and at the system level. With ICsense, we found such a partner for the development of our RF front-end. Their high quality of service, innovation, IC knowledge and dedication has been instrumental to our success to date. We look forward to continued success with ICsense as a key technology partner for the foreseeable future.

Yuval Cohen, CTO at Audiopixels ICsense’s turnkey approach which includes test and manufacturing services, delivers an efficient and cost effective mass-production solution to seamlessly integrate the High-Voltage ASIC driver with our MEMS structure