Sensor / MEMS

ICsense specializes in high-performance, ultra-low-power custom IC (ASIC) developments for sensor and MEMS interfacing, leveraging advanced analog front-end architectures and precision data conversion. With deep expertise in mixed-signal technologies across multiple foundries and nodes, ICsense delivers tailored solutions featuring high-resolution ADCs and DACs, transducer-specific analog front-ends, and configurable signal paths, including custom FSMs, DSPs and microcontrollers. These ASICs enable next-generation sensing performance with compact size, combining low noise, high accuracy, and minimal power consumption for even the most demanding environments.

Sensor / MEMS IC design experience

Examples

Time-of-Flight Sensor readout for flow sensors and proximity detection

ICsense develops custom ASICs for Time-of-Flight (ToF) sensor readout, enabling high-precision flow measurement and accurate proximity detection in automotive, industrial, and consumer applications. Our solutions integrate ultra-low-power analog front-ends, high-resolution time-to-digital converters, and advanced signal processing for robust performance in challenging environments. From concept to production, ICsense delivers tailor-made mixed-signal ASICs that ensure accuracy, reliability, and energy efficiency for next-generation ToF sensing systems.

Laser-pulsed ToF

16-bit TDC (Time-to-Digital) with10ps resolution ToF for surveillance proximity detection

Ultrasonic waterfow

On-chip TDC for flow measurements. Jitter of <15ps RMS for 100mV input, zero-flow stability of <7,5ps

MEMS Meets ASIC: Engineering for Accuracy, Efficiency, and Reliability

ICsense specializes in high-precision MEMS interfacing and ultra-low-power solutions for motion, sound, and pressure sensing. Our expertise spans high-voltage MEMS actuation and custom low-power readout chains with reliable performance. Our ASICs enable MEMS sensor and actuator systems to be smarter, smaller, and more efficient. We tackle the full spectrum of MEMS challenges, from non-linearities to temperature dependencies and manufacturing non-idealities. Our solutions compensate for the MEMS mechanical and electrical mismatches and sensitivity variations—leveraging advanced DSP techniques, including on-chip calibration with programmable polynomials.

Gyroscope Interface ASIC

12-bit ASIC with sub-Hz DAC resolution (0.171 Hz/LSB), HV driver chain, and switched capacitor filters in 0.35 µm BCD CMOS (–40°C to 125°C)

MEMS Speaker Driver ASIC

128-channel ASIC with 2 DC-DC converters (2.9V–90V), 64×32 HV switch matrix in 0.35 µm 120V BCD (1.7A peak load)

Sensor / MEMS ASIC examples

ULP sensor read-out ASIC with ISO15693 compliant NFC

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MEMS mirror driver ASIC for interactive projection

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Readout ASIC for IR imaging detectors and cameras

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Ultra-low-power high-accuracy neural recording ASIC

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Piezo analog front-end ASIC for haptic touch

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Time-of-Flight level measurement ASIC for automotive

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Time-Of-Flight receiver channel ASIC with 10psec resolution

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Ultrasonic TX/RX imaging for medical applications

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