ICsense specializes in high-performance, ultra-low-power custom IC (ASIC) developments for sensor and MEMS interfacing, leveraging advanced analog front-end architectures and precision data conversion. With deep expertise in mixed-signal technologies across multiple foundries and nodes, ICsense delivers tailored solutions featuring high-resolution ADCs and DACs, transducer-specific analog front-ends, and configurable signal paths, including custom FSMs, DSPs and microcontrollers. These ASICs enable next-generation sensing performance with compact size, combining low noise, high accuracy, and minimal power consumption for even the most demanding environments.
ICsense develops custom ASICs for Time-of-Flight (ToF) sensor readout, enabling high-precision flow measurement and accurate proximity detection in automotive, industrial, and consumer applications. Our solutions integrate ultra-low-power analog front-ends, high-resolution time-to-digital converters, and advanced signal processing for robust performance in challenging environments. From concept to production, ICsense delivers tailor-made mixed-signal ASICs that ensure accuracy, reliability, and energy efficiency for next-generation ToF sensing systems.
16-bit TDC (Time-to-Digital) with10ps resolution ToF for surveillance proximity detection
On-chip TDC for flow measurements. Jitter of <15ps RMS for 100mV input, zero-flow stability of <7,5ps
ICsense specializes in high-precision MEMS interfacing and ultra-low-power solutions for motion, sound, and pressure sensing. Our expertise spans high-voltage MEMS actuation and custom low-power readout chains with reliable performance. Our ASICs enable MEMS sensor and actuator systems to be smarter, smaller, and more efficient. We tackle the full spectrum of MEMS challenges, from non-linearities to temperature dependencies and manufacturing non-idealities. Our solutions compensate for the MEMS mechanical and electrical mismatches and sensitivity variations—leveraging advanced DSP techniques, including on-chip calibration with programmable polynomials.
12-bit ASIC with sub-Hz DAC resolution (0.171 Hz/LSB), HV driver chain, and switched capacitor filters in 0.35 µm BCD CMOS (–40°C to 125°C)
128-channel ASIC with 2 DC-DC converters (2.9V–90V), 64×32 HV switch matrix in 0.35 µm 120V BCD (1.7A peak load)
A MEMS sensor (Micro-Electro-Mechanical Systems sensor) is a miniature device that combines microscopic mechanical structures with integrated electronics to measure physical parameters such as motion, pressure, flow, sound, or magnetic fields.
MEMS sensors are fabricated using semiconductor manufacturing techniques similar to those used for integrated circuits, allowing mechanical elements—such as tiny beams, membranes, or masses—to be built directly on a silicon chip.
A MEMS sensor operates in three main steps:
The mechanical structure inside the MEMS device reacts to a physical stimulus. For example, acceleration can move a tiny mass, while pressure can deform a microscopic membrane.
This mechanical movement changes an electrical property such as capacitance, resistance, or charge, creating a very small analog signal.
Because the sensor signal is extremely small, specialized electronics are required to amplify, filter, and convert it into digital data that can be processed by electronic systems.
This signal processing is typically implemented using a dedicated sensor interface ASIC, which performs precision amplification, analog-to-digital conversion, and digital calibration.
Companies such as ICsense develop custom mixed-signal ASICs that interface with MEMS sensors, enabling accurate signal readout, temperature compensation, and low-power operation for applications in automotive systems, industrial monitoring, medical devices, and consumer electronics.
MEMS sensors typically generate very small analog signals (capacitive, resistive, piezoelectric, optical, etc.) that cannot be used directly by digital systems. A dedicated Application-Specific Integrated Circuit (ASIC) is required to interface with the sensor and convert these weak signals into accurate, usable data.
A MEMS sensor ASIC performs several critical functions:
A custom ASIC (Application-Specific Integrated Circuit) can interface with many different types of MEMS sensors, depending on the sensing principle used to convert a physical quantity into an electrical signal.
MEMS sensor interface ASICs are typically designed to support the following sensing technologies:
Capacitive sensors measure changes in capacitance caused by mechanical movement of microstructures. They are commonly used in:
These sensors require highly sensitive capacitance-to-digital conversion and low-noise analog front-end circuits.
Resistive sensors detect changes in electrical resistance due to strain or pressure. They are often implemented as Wheatstone bridge structures and are widely used in:
ASICs for these sensors typically include precision amplifiers and high-resolution ADCs.
Piezoelectric sensors generate electrical charge when mechanical stress is applied. They are commonly used for:
These sensors require charge amplifiers and specialized signal conditioning.
Some MEMS devices interact with light or modulate optical signals. These sensors are used in:
The ASIC processes optical signals and performs timing or distance calculations.
Thermal sensing structures measure changes in heat flow or temperature distribution and are often used in:
ASICs for thermal sensors typically include temperature measurement and compensation circuits.
Because each MEMS sensing principle produces different electrical signals, the sensor interface ASIC must be carefully designed to match the sensor physics and signal characteristics.
Companies such as ICsense specialize in developing custom mixed-signal ASICs that interface with MEMS sensors, integrating precision analog front-ends, data converters, and digital calibration to achieve high-accuracy sensing in automotive, industrial, medical, and consumer applications.
A custom ASIC (Application-Specific Integrated Circuit) offers significant advantages compared with discrete electronics or generic IC solutions. By integrating the required analog, digital, and signal-processing functions into a single chip, a custom ASIC can optimize performance, power consumption, and system integration for a specific sensing application.
Key advantages of a custom ASIC include:
A custom ASIC can be designed with precision analog front-ends, high-resolution ADCs, and optimized signal paths tailored to the specific sensor technology. This allows higher sensitivity, lower noise, and more accurate measurements than generic solutions.
Custom ASIC architectures can be optimized for ultra-low-power operation, making them ideal for battery-powered and always-on sensing systems such as IoT devices, wearables, and industrial sensors.
By integrating multiple electronic functions into a single chip, a custom ASIC reduces the number of external components. This results in smaller system size, reduced bill-of-materials (BOM), and improved reliability.
Custom ASICs can integrate digital signal processing (DSP) and on-chip calibration to compensate for sensor non-linearities, temperature drift, and manufacturing variations, improving overall system stability and performance.
Because the ASIC is designed specifically for the target sensor and application, it enables optimized system architectures, improved robustness, and long-term product differentiation.
Companies such as ICsense specialize in developing custom mixed-signal ASICs for sensor and MEMS applications, integrating precision readout electronics, advanced data conversion, and digital compensation to deliver highly accurate, low-power sensing solutions for automotive, industrial, medical, and consumer systems.
MEMS sensor ASICs are used across a broad range of sectors that depend on precise, compact, and low‑power sensing solutions. Key industries include:
Companies such as ICsense specialize in developing custom mixed-signal ASICs for sensor and MEMS applications, integrating precision readout electronics, advanced data conversion, and digital compensation to deliver highly accurate, low-power sensing solutions for automotive, industrial, medical, and consumer systems.
Companies typically consider a custom ASIC for MEMS interfacing when performance, power efficiency, form‑factor, or long‑term product stability exceed what standard off‑the‑shelf electronics can provide. Several key situations support this choice:
Custom ASICs avoid redundant functions found in general‑purpose ICs, resulting in significantly lower power consumption—an advantage in battery‑driven MEMS devices such as wearables, portable medical sensors, or IoT nodes.
By integrating only the necessary functions, ASICs achieve far smaller footprints than standard ICs. This is especially critical for MEMS sensors, which often require compact, tightly coupled signal‑conditioning electronics.
MEMS transducers often output extremely small signals that require optimized analog front‑ends, filtering, and low‑noise amplification. Custom ASICs can be tailored to the exact MEMS structure, achieving better accuracy, lower noise, and tighter compensation than generic electronics. Integration of MEMS with dedicated ICs is common practice because ICs handle critical functions such as amplification, filtering, ADC conversion, and processing.
Standard ICs offer lower upfront cost and faster time‑to‑market, but for high‑volume products, the cost per unit of an ASIC becomes significantly lower due to the elimination of unnecessary circuitry and optimized manufacturing. ASIC investments are generally justified for large production runs where the NRE (non‑recurring engineering) cost can be amortized.
Standard ICs can become obsolete, forcing redesigns. Custom ASICs ensure long‑term availability—critical in industrial, automotive, and medical sectors where product lifetimes can span 10–20 years.
Companies such as ICsense specialize in developing custom mixed-signal ASICs for sensor and MEMS applications, integrating precision readout electronics, advanced data conversion, and digital compensation to deliver highly accurate, low-power sensing solutions for automotive, industrial, medical, and consumer systems.
