ICsense offers complete packaging support for custom analog, mixed-signal, and high-voltage ASICs. Our solutions are tailored to meet the electrical, thermal, mechanical, and regulatory demands of your application — whether in automotive, medical, industrial, or consumer markets. Packaging decisions are integrated early in the design process to ensure optimal performance, cost-efficiency, and long-term reliability.
We deliver production-ready ICs through in-house testing and strong partnerships with trusted OSATs and our TDK network. Our team manages the full supply chain – from wafer testing to final delivery – with full traceability and quality control. Whether you’re prototyping or scaling to high-volume production, we offer flexible packaging strategies and a wide range of formats, including QFN, WLCSP, and custom SIPs.
ICsense provides plastic, leadless, die-form and ceramic packaging solutions tailored to your application’s electrical, thermal, and mechanical needs. Fast engineering samples can be produced using QTA (Quick Turnaround Assembly).
ICsense offers Wafer-Level Chip-Scale Packaging (WLCSP), Cu-pillar bumping, and bumped die solutions as part of its full turnkey ASIC development service. These advanced formats are ideal for ultra-compact, high-performance applications in wearables, medical implants, and mobile devices.
What sets ICsense apart is our comprehensive design-level support. In parallel with ASIC floor planning and layout, we optimize pad positioning, RDL redistribution, under bump metallization (UBM), and bump design to ensure electrical integrity, thermal performance, and manufacturability. We also provides dedicated wafer inspection and testing, guaranteeing quality and reliability from tape-out to final delivery.
These packaging options are available exclusively within our complete ASIC design and supply flow, ensuring seamless integration from silicon to system.
(Image courtesy of JCET)
Bare die solutions are ideal for compact, high-performance systems where space and reliability are critical. ICsense offers flexible bare die delivery options to support seamless integration into your custom devices. Whether you need tested wafers or individual bare dies, we ensure precision, quality, and traceability at every step:
At ICsense, we push the boundaries of advanced packaging with our CuPillar-based assembly, enabling ultra-fine pitch interconnects down to 50 µm. This breakthrough goes far beyond traditional WLCSP (Wafer-Level Chip-Scale Packaging), unlocking new possibilities for high-bandwidth, high-performance systems.
Our CuPillar technology is a cornerstone in demanding applications such as High Bandwidth Memory Interfaces (HBMI), high-performance ASICs, and advanced sensor and mixed-signal designs, where extreme interconnect density and reliability are critical. Advantages of CuPillar technology
