ICsense is one of Europe’s leading custom ASIC suppliers, offering a complete solution from concept to mass production. We guide customers through every stage of the ASIC lifecycle, ensuring a robust, scalable, and cost-effective manufacturing process—from foundry selection to tested and packaged products. Our extensive foundry network includes all major global semiconductor manufacturers (consult our foundry network), providing
• Process technology flexibility
• Supply chain security
• Tailored technology options for your application
ICsense operates in-house Automated Test Equipment (ATE) based on Advantest 93K platforms, enabling the development of highly optimized test software and hardware for each ASIC. Our modular test development flow ensures fast, reliable, and cost-efficient test solutions across all production volumes. With our in-house wafer probing and final test capabilities, complemented by close collaboration with our OSAT partners and TDK, we can offer low- to high-volume production testing for any application.
ICsense designs that entered mass production last year
Our experienced product engineering team manages the entire back-end process, including first silicon validation, yield optimization, failure analysis and return handling. With over two decades of experience, ICsense ensures high-quality, scalable ASIC production that meets the demands of industrial, automotive, medical, and consumer markets.
Last year alone, ICsense-designed chips were produced in +500 million units, showcasing our ability to scale reliably and deliver in volume. Whether you’re launching a niche product or scaling to global demand, ICsense is your trusted partner from concept to production
At ICsense, we provide excellent in-house production test capabilities to support our customers from prototype to full-scale production. Our in-house ATE team uses our unique modular test development flow to create custom test solutions for each ASIC, ensuring high test coverage and short test times.
Operating multiple Advantest V93K testers with both wafer probing and final test handlers, we cover the full spectrum of test engineering, characterization, and volume testing for low- to medium-volume production—all under one roof. This integrated approach significantly reduces test development cycles, simplifies debugging, and results in the most cost-effective and optimized test solutions. For higher volumes or second-source strategies, ICsense collaborates closely with trusted OSAT (Outsourced Semiconductor Assembly and Test) partners and TDK production sites, ensuring a flexible and scalable test infrastructure that adapts to any production need.
Our dedicated in-house product engineering team manages the entire ASIC back-end process—from first silicon through volume production to end-of-life support, across any production scale. This comprehensive control ensures consistent quality, cost-efficiency, and on-time delivery throughout the ASIC lifecycle.
Working in close collaboration with our design team, suppliers, and customers, the product engineering team drives continuous improvement in yield, quality, and manufacturing efficiency. Through detailed root cause and failure analyses, they proactively identify opportunities for cost reduction, process optimization, and product enhancements.
During production, the team serves as the central interface between the customer and our supply chain, providing responsive support for technical inquiries, qualification processes, failure analysis, 8D reporting, reliability assessments, and testability reviews. When necessary, they issue Process Change Notifications (PCNs) with detailed impact analysis to ensure full transparency and traceability.
The assembly and packaging process is managed through our trusted network of specialized partners, enabling a wide range of standard and advanced packaging options. From commercially available plastic packages such as QFN, DFN, and BGA, to Wafer-Level Chip-Scale Packages (WLCSP) and custom solutions like stacking, chip-on-flex, chip-on-glass, chip-on-board, and System-in-Package (SiP), we ensure that each ASIC is delivered in the most suitable form for its application.
With over 20 years of experience in package selection and assembly coordination, the ICsense development team provides expert guidance to define the most cost-effective and technically optimal packaging solution for every customer. Our deep understanding of packaging technologies and long-standing relationships with leading assembly partners allow us to tailor solutions that meet the specific mechanical, thermal, and electrical requirements of each project.
Before entering volume production, every ASIC developed by ICsense undergoes a rigorous industrialization process to ensure it meets the highest standards of reliability, robustness, and manufacturability. This phase includes extensive reliability testing and statistical analysis, tailored to the specific application, market, and mission profile of the chip.
Depending on the end-use requirements, testing typically includes ESD (Electrostatic Discharge), Latch-Up (LU), Temperature Cycling (TC), Accelerated Lifetime Testing such as HAST (Highly Accelerated Stress Test) and ELFR (Early Life Failure Rate) in accordance with industry standards such as AEC-Q100 for automotive-grade devices or other relevant specifications for medical, industrial, or consumer applications.
In addition to reliability testing, ICsense performs detailed characterization on both typical and corner (skewed) wafers to validate manufacturing robustness and ensure consistent performance across process variations. This includes electrical characterization, parametric analysis, and statistical validation to confirm that the ASIC meets all functional and environmental requirements.
ICsense manages the mass production of custom ASICs across all volume levels—either in-house or through trusted partners including OSAT providers and TDK. Our production model is designed to scale seamlessly, supporting low to medium volumes in-house or with European OSAT partners (from a few tens of thousands up to several million units) and transitioning to high-volume manufacturing with IDMs or TDK for volumes exceeding 100 million units per year.
This flexible approach ensures that customers benefit from cost-effective production, short lead times, and supply chain resilience. Our production flow is fully aligned with that of our external partners, enabling second-source compatibility and secure volume ramp-up without disruption.
Throughout the entire production lifecycle, our experienced product engineering team oversees and monitors operations—regardless of the manufacturing site—using dedicated statistical analysis tools to ensure consistent quality, yield optimization, and traceability. This guarantees that every ASIC meets the highest standards of performance, reliability, and long-term support.
