Supply Chain Management

ICsense manages the mass production and supply of its custom ASICs across all volume levels—either in-house or through trusted partners and TDK. This flexible approach ensures that customers benefit from cost-effective production, short lead times, and supply chain resilience. Our in-house production flow is fully aligned with that of our external partners, enabling second-source compatibility and secure volume ramp-up without disruption.
ICsense takes full ownership of the production process, handling every technical and administrative detail—from supplier management and logistics to insurance, customs, and VAT—so customers can focus entirely on their core business. 

Proven Scalable Production Model: From Low to High Volumes

Our production model is designed to scale seamlessly, supporting low to medium volumes in-house or with European OSAT partners (from a few 10 thousand up to several million units) and transitioning to high-volume manufacturing with IDMs or TDK for annual volumes of several tens of millions of units. Each of these models is currently in use and has repeatedly proven its effectiveness across diverse scenarios.
Throughout the entire production lifecycle, our experienced product engineering team oversees and monitors operations—regardless of the production model—using dedicated statistical analysis tools to ensure consistent quality, yield optimization, and traceability.

WAFER SOURCING

WAFER SORT

ASSEMBLY

FINAL TEST

SUPPLY

In-house product engineering

Working in close collaboration with our design team, suppliers, and customers, our product engineering team drives continuous improvement in yield, quality, and manufacturing efficiency. Through detailed root cause and failure analyses, they proactively identify opportunities for cost reduction, process optimization, and product enhancements.
During production, the team serves as the central interface between the customer and our supply chain, providing responsive support for technical inquiries, qualification processes, failure analysis, 8D reporting, reliability assessments, and testability reviews. When necessary, they issue Process Change Notifications (PCNs) with detailed impact analysis to ensure full transparency and traceability.

Industrialisation and qualification

Before entering volume production, every ASIC developed by ICsense undergoes a rigorous industrialization process to meet the highest standards of reliability, robustness, and manufacturability. This phase includes extensive reliability testing and statistical analysis, tailored to the specific application, market, and mission profile of the chip.

Depending on the end-use requirements, testing typically includes ESD (Electrostatic Discharge), Latch-Up (LU), Temperature Cycling (TC), Accelerated Lifetime Testing such as HAST (Highly Accelerated Stress Test) and ELFR (Early Life Failure Rate) in accordance with industry standards such as AEC-Q100 for automotive-grade devices or other relevant specifications for medical, industrial, or consumer applications.

In addition to reliability testing, ICsense performs detailed characterization on both typical and corner (skewed) wafers to validate manufacturing robustness and ensure consistent performance across process variations.
The industrialization phase is a critical step in ICsense’s commitment to delivering high-quality, zero-defect ASICs that are ready for scalable, long-term production.

Don’t take our word for it, take theirs