At ICsense, one of our core specializations is the development of high-voltage integrated circuits (ICs) using advanced BCD, HVCMOS, and SOI technologies. We collaborate with leading semiconductor foundries across a wide range of technology nodes, delivering next-generation performance for automotive, industrial, medical, and consumer electronics.
Our custom IC designs support voltages up to +150V on-chip, making them ideal for demanding applications such as Electric Vehicles (EVs), Medical implants (e.g., neuromodulation devices), MEMS-based systems (high-voltage actuation/baising), haptics and tactile feedback, ultrasound imaging, LED lighting and smart illumination, audio systems and micro-speakers.
ICsense is a trusted leader in custom high-voltage ASIC development for cutting-edge neuromodulation ASICs, including Deep Brain Stimulation (DBS), Vagus Nerve Stimulation (VNS), spinal cord stimulation, cochlear implants, and sleep apnea treatments.
Our ASICs feature advanced electrode-array drivers for precise neural stimulation, high-voltage programmable pulse generation with integrated charge balancing for patient safety, efficient DC-AC-DC power conversion for compact, low-power implantable devices. The newest ASICs incorporate artefact reduction techniques to maintain high signal integrity during stimulation. These capabilities enable closed-loop neuromodulation systems that are both energy-efficient and highly reliable, supporting the next generation of implantable medical devices.
ICsense provides high-voltage ASIC solutions specifically tailored for MEMS applications, combining deep expertise in analog and mixed-signal design with advanced system-level modeling. Our custom ASICs enable precise MEMS actuation through integrated high-voltage drivers, MEMS speakers, MEMS mirrors, and MEMS biasing for better SNR. The high-voltage IP portfolio includes charge pumps, DC-DC converters such as buck, boost, and flyback topologies, as well as H-bridges, capacitive load drivers, and piezoelectric drivers. To ensure robust and reliable system performance, ICsense’s MEMS ASICs also feature on-chip calibration, advanced digital signal processing (DSP), and compensation mechanisms for non-idealities including parasitic oscillations, temperature drift, and manufacturing variations.
ICsense delivers advanced high-voltage ASIC solutions for ultrasound and piezoelectric sensing and actuation systems, enabling direct interfacing of PZT transducer elements to the die. Our ultrasound ASICs integrate both transmit (TX) and receive (RX) analog front-ends with +2000 channels, with transmit capabilities typically reaching +60 Vpp at MHz-range operating frequencies, and sub-Vpp sensitivity on the receive side. An on-chip waveform generator allows full parametrization of TX signals, while integrated high-voltage/low-voltage protection switches ensure safe and seamless transitions between transmission and reception modes.
The analog RX path includes a transconductance preamplifier and a balanced mixer, enabling precise signal processing. Configuration at the element or group level is managed via a robust LVDS interface, offering dynamic control over RX phase, TX delay, and waveform shaping. Embedded delay and phase computation further enhance performance, supporting high-resolution imaging and sensing in compact, power-efficient designs.
