The chipset is developed for large-scale, portable X-ray applications for a-Si backplanes. It consists of a high-voltage row-driver ASIC that controls the TFT pixels and a low-noise, column readout ASIC that reads the charges from the pixels.

The chipset is developed for large-scale, portable X-ray applications for a-Si backplanes. It consists of a high-voltage row-driver ASIC that controls the TFT pixels and a low-noise, column readout ASIC that reads the charges from the pixels.
The chipset achieves state-of-the-art noise levels with much lower power consumption and cost. The chips are assembled on the glass panel using chip-on-glass flip-chip technology with ACF. The ASICs are currently used in commercial X-ray imagers.
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