ICsense at GSA Munich, 10-11 June 2026
ICsense will be present at the upcoming GSA European Executive Forum in Munich, taking place on June 10–11, 2026. As one of the key gatherings for the global semiconductor industry, the event provides an excellent opportunity to exchange insights, strengthen partnerships, and explore the latest trends shaping the future of IC design. Representing ICsense, Wim […]
Med-Tech UK | 3-4 Jun 2026
Showcasing our medical ASIC experience at MedTech UK ICsense will be exhibiting at Med‑Tech Innovation Expo UK, where it will present its latest custom IC solutions for brain–computer interfaces (BCI), neuromodulation, and medical wearables. At the event, visitors can meet the ICsense team to discuss how custom analog and mixed‑signal ASICs enable ultra‑low‑noise neural signal […]
ICsense at Embedded World | Hall 4 – 558
ICsense to Exhibit at Embedded World 2026 – Visit us in Hall 4, Booth 558 ICsense, a leading European supplier of custom ASIC development and supply, will participate in Embedded World 2026, taking place 10–12 March 2026 in Nuremberg, Germany. The embedded world Exhibition & Conference is globally recognized as the premier meeting hub for […]
ICsense Increases In-House ASIC Volume Production Capability with Opening of New Electrical Wafer Sort Cleanroom
Europe’s leading fab-independent IC design organization strengthens production capabilities with ISO-7 certified cleanroom; fab-independence provides agility as part of customer-centric approach. ICsense, a TDK Group company and leading fab-independent European design group with world class expertise in analog, digital, mixed signal and high voltage integrated circuit design, has opened a new Electronic Wafer Sort (EWS) […]
NANS 2026 – ASICs for neuromodulation and recording
ICsense, a leading IC design company based in Leuven, Belgium, specializes in the development of custom integrated circuits (ICs) for high-reliability markets, including the medical sector. As a subsidiary of the TDK group, ICsense leverages its extensive expertise in analog, mixed-signal, and high-voltage IC design to deliver innovative solutions tailored to the unique demands of […]
Compact, Ultra-Low-Power ASIC for Next-Gen Magnetic Sensing
ICsense has successfully taped out a new custom ASIC (Application Specific IC) for dual magnetic sensing applications: The design focused on three priorities: smaller size, lower cost, and minimal power consumption. Ultra-compact: Die size under 1 mm², with just 4 pins in the final packageCost-efficient: Optimized for minimal die area and reduced test costPower-saving:• Only a […]
Automotive mission to Sweden
ICsense to Present Custom ASIC Innovations in Gothenburg ICsense, a leading expert in custom mixed-signal ASIC design, will be traveling to Gothenburg to showcase how its tailor-made ASIC solutions are enabling the next generation of automotive electronics. Jeroen Van Ham, Sr Business Development Mgr at ICsense will be present throughout the week at multiple innovation […]
ICsense obtained CIR accreditation
We’re proud to share that ICsense has officially obtained the CIR accreditation (Crédit d’Impôt Recherche) from the French Ministry of Higher Education and Research. This recognition confirms our commitment to cutting-edge R&D in custom IC design and innovation. It also means that our French clients can benefit from tax incentives when collaborating with us on […]