Sensor/ASIC integration challenges for automotive and industry 4.0. How to tackle them ?

Sensor/ASIC integration challenges for automotive and industry 4.0. How to tackle them ?

On Feb 14th, Jeroen Van Ham from ICsense will speak at the MEMS & Sensors Technical Congress 2018 in Monterey, California.

Abstract:

The sensor and actuator market will rise with 12% CAGR in the coming 4 years. Mostly these devices are delivered to the end-customers with the mixed-signal interface ASIC (Application Specific IC) as part of the module. With a target ASP (Average Selling Price) below 1$, the cost pressure on both interface ASIC as well as sensor element is high.    In this presentation, we will highlight the market trends and challenges to meet performance, cost and power consumption criteria. How to approach your ASIC development to maximise chances of market succes? What are the myths around sensor interfacing ASICs? A special part of this presentation is devoted to high-reliability sensor interfacing for industrial and automotive markets. In this area, functional safety (IEC61508 – ISO26262) comes into play which impacts the design philosophy. Dedicated on-chip diagnostics are implemented to provide a reliable solution for your end-customer.    Examples of sensor/ASIC developments will be given in the area of pressure sensors, gas sensors, gyro/accelerometers and magnetic (TMR) sensors. (more info)

Conference registration: https://www.xpressreg.net/eReg/RegDemoE-Reg.asp?rc=&aban=&p1=&li=

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