Newsletter June 2012

Newsletter June 2012

Business update: ICsense signs 65th project

In business since 2004, ICsense announces the successful closing of its 65th design-contract. “The market interest in medical ASICs and consumer MEMS products has drastically increased the last 3 years. Especially in these markets, ASICs have stringent power consumption requirements. Our experience in high-efficient power management (DC/DC, … ) has always been one of the differentiators of ICsense. We are proud to announce that we are ahead of schedule in filling our order book. To keep up with the demand, we enlarged our team to 36 engineers in our Leuven headquarters”, explains CEO Bram de Muer.

There is a strong demand to handle the complete ASIC cycle (from first idea towards supply of the chips). De Muer continues; “This is exactly what we deliver our clients: an experienced project team that knows your business and succesfully guides the project from as early as building your specification on. Up to now, we never needed more than 2 runs to reach fully in-spec silicon. Thereby guaranteeing a fast time-to-market with a reliable product.”

Meet us at the TSMC Symposium / Bits and Chips HW conference

ICsense will be at the European Technology Symposium of TSMC. The event takes place on June 19th in Amsterdam, The Netherlands. Having worked in all major technology nodes from TSMC (including 40nm and 28nm), ICsense is an experienced design partner for your custom IC development. Earlier this month, on June 13th, ICsense will present on the Bits and Chips Hardware Conference in ‘s Hertogenbosch, The Netherlands. The talk will be on “Ultra-low-power analog and mixed-signal ASICs in medical applications and smartphones”.

To book a one-to-one meeting, please contact us at sales@icsense.com or tel. +32 16 589 721.