Oct 23-24, 2017 – World of Sensors
What is it? InvenSense is part of TDK! Together with the TDK family of sensor companies, which includes EPCOS, ICsense, Micronas, and Tronics, we are excited to invite you to the 6th annual TDK Sensors Developers Conference, the largest MEMS and Sensor based developers conference in the world. Bringing together System OEM’s, H/W developers, S/W […]
ASIC as enabler for eHealth
ICsense will present at Silicon Saxony day on Tuesday June 20th in the Expert session called “Smart Health”. More info “THE ASIC AS ENABLER FOR EHEALTH” Future healthcare will become largely dominated by electronics. The transition from hospital based care, through home care and consumer wearables is only possible by the innovations in IC design. […]
June 13th, TSMC symposium
Join ICsense at the annual TSMC Technology Symposium and learn about TSMC’s new technologies, advanced backend capabilities, and future development plans. With an analog and mixed-signal design group of over 70 people, ICsense is seen as one of the main design centers in Europe with a strong expertise in a variety of TSMC processes (going […]
Minalogic B2B meetings (Grenoble – 26/04)
International Business Meetings for micro/nano-Technologies MINALOGIC Business Meetings, on April, 26th 2017 in GRENOBLE, proposes one-to-one international business meetings in a move to facilitate the internationalization of projects and bring together developers and key accounts from target countries such as Belgium, Germany, Italy, Japan, the Netherlands, Taiwan, the UK and the US. ICsense will participate to […]
ICsense becomes part of TDK group
ICsense, the leading European mixed-signal IC design company, announced today that TDK’s wholly-owned subsidiary TDK-Micronas GmbH (“TDK-Micronas”), a leading supplier of Hall-effect sensors based in Freiburg, Germany, and ICsense NV have signed an agreement of acquisition of shares. This transaction is a win-win opportunity for both ICsense and TDK. ICsense can further boost its ASIC […]
Presentation lab-on-chip on Jan 31st
To support innovations in the healthcare domain at the crossroads of the Key Enabling Technologies of biotechnology and digital technologies, DSP Valley and FlandersBio are launching 3 separate platforms: (1) smart implants, (2) (bio)medical imaging and (3) lab-on-chip & diagnostics. During the launch of the latter platform (LoC & Diagnostics) ICsense will present its expertise in ASIC (Application Specific ICs) […]
Embedded World 2017 | 14 – 16.03.17 (Hall 3 – 121)
Embedded world is the leading international fair for embedded systems. Be it security for electronic systems, distributed intelligence, the Internet of Things or e-mobility and energy efficiency – the embedded world trade fair in Nuremberg enables you to experience the whole world of embedded systems. Contact sales@icsense.com to fix an appointment upfront and we will send you […]
Customer exclusive ASIC supply at Electronica 2016
Between 8 – 11 November, the Electronica fair will take place in München, Germany. Visit ICsense and learn more about customer exclusive ASIC supply and world-class IC design outsourcing. ICsense will have its booth in Hall A5. About Electronica: Whether it comes to PCBs, semiconductors, sensors, connectors or displays: electronica is the best […]
Mixed-Signal ASICs for Space applications
6th International Workshop on Analogue and Mixed-Signal Integrated Circuits for Space Applications 12th – 15th June 2016 Organized in collaboration with ESA, AMICSA is an international forum for the presentation and discussion of recent advances in analogue and mixed-signal design techniques and technologies for space applications. ICsense brought to production multiple radiation hardened (rad hard) ASICs of which the analog parts were designed […]
TSMC symposium – June 14th (Amsterdam)
ICsense will join the 2016 TSMC Technology Symposium at the Hilton Amsterdam Airport Schiphol. The symposium will discuss updates on TSMC’s advanced and specialty technologies, advanced manufacturing capabilities and future development plans. ICsense has worked in following TSMC technology nodes: 28nm, 40nm, 90nm, 0.18u and 0.35um, with a sweet spot today for High-Voltage mixed-signal ASICs being 0.18um and 0.35um. Those […]