Oct 23-24, 2017 – World of Sensors

What is it? InvenSense is part of TDK! Together with the TDK family of sensor companies, which includes EPCOS, ICsense, Micronas, and Tronics, we are excited to invite you to the 6th annual TDK Sensors Developers Conference, the largest MEMS and Sensor based developers conference in the world. Bringing together System OEM’s, H/W developers, S/W […]
Master thesis award 2017

ICsense rewarded Kushal Dakshina Murthy for his Master Thesis in Micro-Electronics KU Leuven. Like this story ? Subscribe to the ICsense newsletter ! We provide news a few times a year to our valued subscribers. You will receive insights on the semiconductor market, trends, press releases and useful information about ASIC developments. Alternatively, […]
ASIC as enabler for eHealth

ICsense will present at Silicon Saxony day on Tuesday June 20th in the Expert session called “Smart Health”. More info “THE ASIC AS ENABLER FOR EHEALTH” Future healthcare will become largely dominated by electronics. The transition from hospital based care, through home care and consumer wearables is only possible by the innovations in IC design. […]
June 13th, TSMC symposium

Join ICsense at the annual TSMC Technology Symposium and learn about TSMC’s new technologies, advanced backend capabilities, and future development plans. With an analog and mixed-signal design group of over 70 people, ICsense is seen as one of the main design centers in Europe with a strong expertise in a variety of TSMC processes (going […]
Carolien Martens joins ICsense

Carolien Martens has joined the business development team at ICsense to boost the company’s activity in exclusive ASIC development and supply. Carolien worked 12 years at IMEC in various business roles and has in-depth experience in strategic project development and the coordination of funded projects. In her new role as Business Development Manager for ICsense, […]
Minalogic B2B meetings (Grenoble – 26/04)

International Business Meetings for micro/nano-Technologies MINALOGIC Business Meetings, on April, 26th 2017 in GRENOBLE, proposes one-to-one international business meetings in a move to facilitate the internationalization of projects and bring together developers and key accounts from target countries such as Belgium, Germany, Italy, Japan, the Netherlands, Taiwan, the UK and the US. ICsense will participate to […]
ICsense becomes part of TDK group

ICsense, the leading European mixed-signal IC design company, announced today that TDK’s wholly-owned subsidiary TDK-Micronas GmbH (“TDK-Micronas”), a leading supplier of Hall-effect sensors based in Freiburg, Germany, and ICsense NV have signed an agreement of acquisition of shares. This transaction is a win-win opportunity for both ICsense and TDK. ICsense can further boost its ASIC […]
Watch our new company movie

The journey of an ASIC development ICsense has released its new company movie, offering a unique view into the complete flow of ASIC design and supply. “The majority of today’s incoming requests is in ASIC design and supply. The so-called turnkey model starts at initial discussions about the specification upto high-volume production,” explains Jeroen Van Ham, Business Development Manager at […]
Novel X-ray approach to bring high resolution, safer diagnoses

ICsense developed the high-frame rate custom readout IC in an X-ray European health consortium (including Siemens, BASF, IMEC and others). The cooperation focuses on low radiation, low cost, flat panel X-ray detectors that use novel photonics technology to make diagnosis safer for patients and medical staff. Read the full article here Consortium website
Presentation lab-on-chip on Jan 31st

To support innovations in the healthcare domain at the crossroads of the Key Enabling Technologies of biotechnology and digital technologies, DSP Valley and FlandersBio are launching 3 separate platforms: (1) smart implants, (2) (bio)medical imaging and (3) lab-on-chip & diagnostics. During the launch of the latter platform (LoC & Diagnostics) ICsense will present its expertise in ASIC (Application Specific ICs) […]