ICsense has successfully taped out a new custom ASIC (Application Specific IC) for dual magnetic sensing applications:
- Compass sensing for handheld devices
- 3D magnetic sensing for joystick control
The design focused on three priorities: smaller size, lower cost, and minimal power consumption.
Ultra-compact: Die size under 1 mm², with just 4 pins in the final package
Cost-efficient: Optimized for minimal die area and reduced test cost
Power-saving:
• Only a few µA in sleep mode
• A few hundred µA during measurement
The ASIC includes a TMR sensor readout chain, digital processing with a 16-level FIFO for efficient data handling, and smart power management. It supports both I²C and I³C interfaces, with automatic voltage detection (1.2 V / 1.8 V) at startup.
This achievement marks another milestone in ICsense’s 20-year track record of innovation and precision in custom ASIC development.
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