Compact, Ultra-Low-Power ASIC for Next-Gen Magnetic Sensing

ICsense has successfully taped out a new custom ASIC (Application Specific IC) for dual magnetic sensing applications:

  • Compass sensing for handheld devices
  • 3D magnetic sensing for joystick control

The design focused on three priorities: smaller size, lower cost, and minimal power consumption.

Ultra-compact: Die size under 1 mm², with just 4 pins in the final package
Cost-efficient: Optimized for minimal die area and reduced test cost
Power-saving:
• Only a few µA in sleep mode
• A few hundred µA during measurement

The ASIC includes a TMR sensor readout chain, digital processing with a 16-level FIFO for efficient data handling, and smart power management. It supports both I²C and I³C interfaces, with automatic voltage detection (1.2 V / 1.8 V) at startup.

This achievement marks another milestone in ICsense’s 20-year track record of innovation and precision in custom ASIC development.

#ASICdesign #MagneticSensor #TMR #I3C #LowPower #JoystickSensor #CompassSensor #ICsense #CustomIC #Semiconductor #Innovation #MixedSignal #EngineeringExcellence

More news articles

NANS 2026 – ASICs for neuromodulation and recording

Read more

Automotive mission to Sweden

Read more

ICsense obtained CIR accreditation

Read more