ASIC Design and Supply

Developing a custom ASIC -tailored to your application- can uplift your product and set you apart from the competition. At ICsense, we specialize in designing and delivering the right ASIC solution to power your next innovation. ICsense offers the complete flow from concept, design through mass production of your custom ASIC across the spectrum of sensor/MEMS interfacing, high-voltage, power and battery management, communication, and ultra-low-power ASIC designs.

Our end-to-end, one-stop-shop service is designed to unburden you and provide the best possible custom ASIC solution. With in-house design teams, in-house ATE testing, and a strong network of partners and foundries, we seamlessly integrate all the key ingredients to develop a successful ASIC—branded with your name. 

Our commitment - from concept to volume production

ASIC DEFINITION

ASIC DEVELOPMENT

MANUFACTURING

INDUSTRIALISATION

SUPPLY

"We build longterm relationships with our customers by supplying innovative and cost effective ASICs to support their product roadmap."

ASIC development projects at ICsense consist of 5 stages:

ASIC definition

  • Feasibility study and architectural definition
  • System trade-offs versus design risk and complexity
  • Selection of technology and package
  • Performance, power, area calculations
  • Production test and qualification strategy
  • Business case optimization: NRE, unit cost and timing
  • First risk analysis (FME(D)A)
  • Functional Safety (DIA)

Development and verification

  • Design of advanced analog, mixed-signal, high-voltage integrated circuits
  • Digital design, VHDL/Verilog coding, verification, synthesis, STA, LEC, …
  • Design for testability (DFT), ATPG, scan chain
  • Full PVT (process voltage temperature) and Monte Carlo simulations
  • Layout and digital place & route
  • ESD/LU, EMC, MRI, ISO pulses, …
  • DfM (Design for Manufacturing) and DfT (Design for Test)
  • Production (ATE) test specification

Manufacturing

  • Support of 45+ technology nodes 
  • Foundry selection (Global Foundries (GF), TSMC, XFAB, ON, UMC, SMIC, Tower, Samsung, Texas Instruments (TI), AMS, …) (more info)
  • Mask generation (SLM, MLM, MPW shuttles, short loop wafers)
  • Supplier management

Assembly

  • QFN(P), BGA, SOT, SOP, TSSOP, ceramic, …
  • Bumping (incl. RDL), WLCSP (Wafer Level Chip Scale Packaging) solutions
  • Delivery of bare dies in various forms (blue foil, waffle packs, tested wafers, …)
  • Custom solutions like stacking, chip-on-flex, chip-on-glass, chip-on-board (COB) and System-in-Package (SiP)

Test solutions

  • Fully equipped measurement lab (350 m2) for ATE test correlation and bench testing (more info)
  • In-house ATE Advantest V93K platforms for test development and production
  • Accretech wafer probing (EWS) and final test handlers
  • Management of outsourced production testing with OSATs or TDK

Qualification and industrialisation

  • Full characterization (typical and corner/skewed wafers)
  • ESD, LU, EMC, …
  • Package qualification
  • Safe-launch/burn-in
  • Typical qualification standards:  JESD47G (Industrial), AEC-Q100 (Automotive), MIL-STD-883 (Military)

Supply

  • Wafer ordering and production follow-up by our PE team
  • Quality control
  • Logistics/insurance
  • Cost optimization through test efficiency and yield management
  • Customer return and FA (Failure Analysis), 8D
  • Support long product life cycles
  • In-house, with our OSAT or by TDK

First-time-functional design philosophy

Silicon wafers are produced as part of the development process of your custom ASIC. This takes up to 3 months. Each additional design iteration requires this time-consuming step. Therefore, the number of design iterations, or so-called “respins,” needs to be minimised to reduce costs and meet project timing. Since its start, ICsense has reached mass production in all its designs with just 1 iteration, providing our customers with fast time-to-market and projects within budget.

Don’t take our word for it, take theirs